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Published By: Mentor Graphics     Published Date: Sep 04, 2009
This paper looks at the issues, materials and current processes being researched to create this integrated Opto-Electronic Circuit Board by European, Japanese and North American organizations.
Tags : 
mentor graphics, high density interconnect (hdi), high speed applications, opto-electronics, photonics, pcbs, opto-electronic circuit board, eobc-optofoil, univ. of ulm, fraunhafer inst, daimler-chrysler, siemens, truemode, terahertz, polyguide, dupont, topcat, nist, goodyear, jiep
    
Mentor Graphics
Published By: IBM     Published Date: Mar 17, 2009
For most electronics and high tech companies, the bill-of-materials (BOM) is the central hub of product definition activities. It conveys the information needed by various departments, such as Engineering, Procurement and Manufacturing, to get the product built. However, current BOM development processes are not well-suited to today’s realities.
Tags : 
global bom, single enterprise solution, bom, bill of materials, product development system, operational efficiency, electronics, manufacturing efficiency, printed circuit boards, pcbs, ibm rational clearcase, clearquest, assemble-to-order (ato), engineer-to-order (eto)
    
IBM
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